This unit is used to orient and measure the end face of a big silicon ingot or other crystals. The end face of silicon crystal with diameter in 0.5-8 inch and weight of 30 kg could be measured with this unit. A sliced wafer could also be measured. There is a vacuum chuck function with this unit. The measured crystal plane could be (100)/(110)/(111)/(210) and so on. The accuracy of the measurement is ±30 ". The minimum reading is 10 ".

There are two working platforms with this unit. According to client’s requirement, on the two working platforms the unit could be furnished to carry out the same task, or measure the ingot or wafer with different diameter on two platforms meanwhile.

The mother apparatus of this unit is Type DX-2. The unit with mother apparatus other than DX-2 is also available. The measure accuracy would be +/-15” and minimum reading 1” if the DX-4A instead of DX-2 is used. Various designs could be made based on client’s special requirement.